STM32F103RDT6 — graded alternatives

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3 verified matches, sorted by compatibility grade and evidence strength. Differences are listed before any compatibility claim. Data source: live tenant catalog. Data verified: 2026-07-13T00:00:00.000Z

The closest documented alternative to STM32F103RDT6 is GigaDevice GD32F103RDT6, graded P2P (pin- and software-compatible candidate, high confidence). Key difference to review first: Max clock 108MHz vs 72MHz. 2 further graded candidates listed below. Every match is an engineering-review candidate, not an unqualified drop-in claim.

Grading methodology: how grades and evidence classes work.

Known differences: GD32F103RDT6 vs STM32F103RDT6

Differences for the other candidates are listed per match below.

3 GRADED MATCHESSORTED BY GRADE · EVIDENCE STRENGTH
P2PCONF · HIGH
GD32F103RDT6★ BEST MATCH
GigaDevice · GigaDevice GD32F103RDT6 Mcu component with source-traceable manufacturer data.
Catalog evidence
Sourcing unconfirmed
Detail
NOT IDENTICAL
  • Max clock 108MHz vs 72MHz
  • Flash is zero-wait SRAM-buffered — timing-sensitive code needs review vs ST
  • 1.2V core via internal LDO; analog peripheral (ADC) behavior differs, validate in-circuit
EVIDENCE
E1GigaDevice compatibility sum-up between GD32 and STM32 (V2.0) · checked 2026-07-13T00:00:00.000Z
Part-number suffix (pin count / density / package / temperature) matches ST exactly · checked 2026-07-13T00:00:00.000Z
PINCONF · MEDIUM
HK · HK HK32F103RDT6 Mcu component with source-traceable manufacturer data.
Catalog evidence
Sourcing unconfirmed
Detail
NOT IDENTICAL
  • HK claims hardware+software compatibility; sample-test ADC, clock and low-power behavior
  • "A" suffix is HK's revision, same pinout as the non-suffixed part
EVIDENCE
E2 · PENDINGHK positions HK32F0xx/F103 as same-part-number STM32 replacements; grade upgrades to P2P once the official compatibility document is archived · checked 2026-07-13T00:00:00.000Z
Part-number suffix matches ST exactly · checked 2026-07-13T00:00:00.000Z
Confidence stays medium until the official document is archived on file.
PINCONF · MEDIUM
HK · HK HK32F103RDT6A Mcu component with source-traceable manufacturer data.
Catalog evidence
Sourcing unconfirmed
Detail
NOT IDENTICAL
  • HK claims hardware+software compatibility; sample-test ADC, clock and low-power behavior
  • "A" suffix is HK's revision, same pinout as the non-suffixed part
EVIDENCE
E2 · PENDINGHK positions HK32F0xx/F103 as same-part-number STM32 replacements; grade upgrades to P2P once the official compatibility document is archived · checked 2026-07-13T00:00:00.000Z
Part-number suffix matches ST exactly · checked 2026-07-13T00:00:00.000Z
Confidence stays medium until the official document is archived on file.
SIDE-BY-SIDE PARAMETERS — CROSS-BRAND, STM32F103RDT6
SPECGD32F103RDT6
GigaDevice · P2P
HK32F103RDT6
HK · PIN
HK32F103RDT6A
HK · PIN
CoreCortex®-M3Cortex-M3Cortex-M3
Speed (MHz)108120120
Flash384K384384
SRAM64K6464
PackageLQFP64LQFP64 (10*10)LQFP64 (10*10)
Temp Range40℃~85℃
Manufacturer-sourced parameters. The original st part's figures are on its own datasheet; differences that matter are itemized per match above.
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Engineering questions about this cross-reference

What are the differences between GD32F103RDT6 and STM32F103RDT6?

Documented differences: Max clock 108MHz vs 72MHz; Flash is zero-wait SRAM-buffered — timing-sensitive code needs review vs ST; 1.2V core via internal LDO; analog peripheral (ADC) behavior differs, validate in-circuit. Review each against your application before committing.

Is GD32F103RDT6 a drop-in replacement for STM32F103RDT6?

GD32F103RDT6 is a P2P-graded engineering-review candidate (pin- and software-compatible candidate). At minimum, review: Max clock 108MHz vs 72MHz. Production use requires validation on your board.

What is the difference between P2P, PIN and FUNC grades?

P2P is a documented drop-in candidate, PIN keeps the package and pinout but needs firmware work, and FUNC is functionally similar but may require a board or BOM change.