STM32F103CBT6 — graded alternatives

4 verified matches, sorted by compatibility grade and evidence strength. Differences are listed before any compatibility claim. Data source: live tenant catalog. Data verified: 2026-07-13T00:00:00.000Z

The closest documented alternative to STM32F103CBT6 is GigaDevice GD32F103CBT6, graded P2P (pin- and software-compatible candidate, high confidence). Key difference to review first: Max clock 108MHz vs 72MHz. 3 further graded candidates listed below. Every match is an engineering-review candidate, not an unqualified drop-in claim.

Grading methodology: how grades and evidence classes work.

Known differences: GD32F103CBT6 vs STM32F103CBT6

Max clock 108MHz vs 72MHz
Flash is zero-wait SRAM-buffered — timing-sensitive code needs review vs ST
1.2V core via internal LDO; analog peripheral (ADC) behavior differs, validate in-circuit

Differences for the other candidates are listed per match below.

4 GRADED MATCHESSORTED BY GRADE · EVIDENCE STRENGTH

P2PCONF · HIGH

GD32F103CBT6★ BEST MATCH

GigaDevice · GigaDevice GD32F103CBT6 Mcu component with source-traceable manufacturer data.

Catalog evidence

Sourcing unconfirmed

Detail

NOT IDENTICAL

Max clock 108MHz vs 72MHz
Flash is zero-wait SRAM-buffered — timing-sensitive code needs review vs ST
1.2V core via internal LDO; analog peripheral (ADC) behavior differs, validate in-circuit

EVIDENCE

E1GigaDevice compatibility sum-up between GD32 and STM32 (V2.0) · checked 2026-07-13T00:00:00.000Z

Part-number suffix (pin count / density / package / temperature) matches ST exactly · checked 2026-07-13T00:00:00.000Z

PINCONF · HIGH

AT32F413CBT7

Artery · Artery AT32F413CBT7 Mcu component with source-traceable manufacturer data.

Catalog evidence

Sourcing unconfirmed

Detail

NOT IDENTICAL

Max clock 200MHz vs 72MHz (review peripheral clock configuration)
Firmware port required: most registers compatible but not all; official migration guide + device pack provided
Operating temperature -40~105°C (T7) wider than ST's -40~85°C (T6)

EVIDENCE

E1Artery official migration guides (archived locally): MG0007 SXX32F103→AT32F403A, MG0003 SXX32F103→AT32F413, MG0025 →AT32A403A; each documents peripheral differences · checked 2026-07-13T00:00:00.000Z

Pin and density codes follow ST naming convention · checked 2026-07-13T00:00:00.000Z

PINCONF · MEDIUM

HK32F103CBT6

HK · HK HK32F103CBT6 Mcu component with source-traceable manufacturer data.

Catalog evidence

Sourcing unconfirmed

Detail

NOT IDENTICAL

HK claims hardware+software compatibility; sample-test ADC, clock and low-power behavior
"A" suffix is HK's revision, same pinout as the non-suffixed part

EVIDENCE

E2 · PENDINGHK positions HK32F0xx/F103 as same-part-number STM32 replacements; grade upgrades to P2P once the official compatibility document is archived · checked 2026-07-13T00:00:00.000Z

Part-number suffix matches ST exactly · checked 2026-07-13T00:00:00.000Z

Confidence stays medium until the official document is archived on file.

PINCONF · MEDIUM

HK32F103CBT6A

HK · HK HK32F103CBT6A Mcu component with source-traceable manufacturer data.

Catalog evidence

Sourcing unconfirmed

Detail

NOT IDENTICAL

HK claims hardware+software compatibility; sample-test ADC, clock and low-power behavior
"A" suffix is HK's revision, same pinout as the non-suffixed part

EVIDENCE

E2 · PENDINGHK positions HK32F0xx/F103 as same-part-number STM32 replacements; grade upgrades to P2P once the official compatibility document is archived · checked 2026-07-13T00:00:00.000Z

Part-number suffix matches ST exactly · checked 2026-07-13T00:00:00.000Z

Confidence stays medium until the official document is archived on file.

SIDE-BY-SIDE PARAMETERS — CROSS-BRAND, STM32F103CBT6

SPEC	GD32F103CBT6 GigaDevice · P2P	AT32F413CBT7 Artery · PIN	HK32F103CBT6 HK · PIN	HK32F103CBT6A HK · PIN
Core	Cortex®-M3	—	Cortex-M3	Cortex-M3
Speed (MHz)	108	200	96	120
Flash	128K	—	128	128
SRAM	20K	32 / 64 / 16 (configurable)	20	20
Package	LQFP48	LQFP48 7x7 mm	LQFP48 (7*7)	LQFP48 (7*7)
Temp Range	40℃~85℃	40 to +105 °C	—	—

Manufacturer-sourced parameters. The original st part's figures are on its own datasheet; differences that matter are itemized per match above.

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Engineering questions about this cross-reference

What are the differences between GD32F103CBT6 and STM32F103CBT6?

Documented differences: Max clock 108MHz vs 72MHz; Flash is zero-wait SRAM-buffered — timing-sensitive code needs review vs ST; 1.2V core via internal LDO; analog peripheral (ADC) behavior differs, validate in-circuit. Review each against your application before committing.

Is GD32F103CBT6 a drop-in replacement for STM32F103CBT6?

GD32F103CBT6 is a P2P-graded engineering-review candidate (pin- and software-compatible candidate). At minimum, review: Max clock 108MHz vs 72MHz. Production use requires validation on your board.

What is the difference between P2P, PIN and FUNC grades?

P2P is a documented drop-in candidate, PIN keeps the package and pinout but needs firmware work, and FUNC is functionally similar but may require a board or BOM change.